LMAS Research Reports - 1998
Download all Research Reports from 1998 (pdf)
Research Report Index
CODEF RESEARCH REPORTS
C. H. Chu, Integrated Design and Manufacturing for Milling Burr Minimization, Sponsored by:CODEF
Exit Burr Minimization by Selecting Tool Feed Direction, Sponsored by:CODEF
A Systematic Approach to Avoid Exit Burr in Milling, Sponsored by:CODEF
Machine Learning Applied to Burr Type Prediction, Sponsored by:CODEF
J. Kim, Control Chart of Drilling Exit Burr in Stainless Steel, Sponsored by:CODEF
Geometric Characteristics of Drilling of Intersecting Holes, Sponsored by:CODEF
Preliminary Experiment of Drilling Burr Formation in Titanium Alloy, Sponsored by:CODEF
J. Hewson Exit Burr Size and Shape in Backplate Assisted Drilling of Ti-6Al-4V, Sponsored by:CODEF
Surface Roughness (Ra) Analysis in Dry Drilling of Ti-6Al-4V, Sponsored by:CODEF
S. Min, Finite Element Modeling of Burr Formation in 2-D Orthogonal Cutting with a Backup Material, Sponsored by:CODEF
Finite Element Modeling of Burr Formation in Drilling Based on 3-D Oblique Cutting Mechanism and CAD/FEA Integration for Drill Geometry Mesh Generation, Sponsored by:CODEF
H. Dechow, Influence of Tool Geometry on Hole Quality when Drilling Ti-6Al-4V, Sponsored by:CODEF
Investigation on the Improvements in Hole Quality when Reaming Ti-6Al-4V, Sponsored by:CODEF/MAPAL Dr. Kress KG, Germany
PRECISION MANUFACTURING RESEARCH REPORTS
Y. Moon, Investigation of the Relationship between Preston's Coefficient and Friction Coefficient in CMP, Sponsored by: NSF/UC SMART
Mechanical Properties and Relationship to Process Performance of the Polishing Pad in CMP, Sponsored by: NSF/UC SMART
Y. Moon & Y. Lee, Study of Slurry Chemical Influence in Ductile/Brittle Transition Depth in CMP Using Acoustic Emission Sensor, Sponsored by: NSF/UC SMART
Y. Moon, The Effect of Slurry Film Thickness Variation in CMP, Sponsored by: NSF/UC SMART
Y. Moon & K. Bevans, Identification of the Mechanical Aspects of Material Removal Mechanisms in CMP, Sponsored by: NSF/UC SMART
Y. Lee, Open Architecture Control in Precision Machining, Sponsored by: Industrial Affiliates of the LMA/NSF
Geometrical Effects of Abrasive Particles in CMP, Sponsored by: Industrial Affiliates of the LMA
Probabilistic Analysis of Ductile/Brittle Transition in Diamond Turning of Brittle Materials, Sponsored by: Industrial Affiliates of the LMA
A. Chang, Quality Oriented Process Planning for Precision Manufacturing, Sponsored by: Industrial Affiliates of the LMA/UC SMART
K. Bevans, Trends in the Semiconductor Industry and the Role of Chemical Mechanical Planarization, Sponsored by: Competitive Semiconductor Manufacturing Program
J. Luo & Y. Moon, Wafer-Scale Modeling of Chemical Mechanical Polishing (CMP) Process Sponsored by: NSF
Y. Nakao & Y. Lee, Ductile Regime Machining of Brittle Material by Single Point Diamond Turning Machining using AE Sensor Feedback, Sponsored by: Industrial Affiliates of the LMA
Y. Nakao, Precision Control of Single Point Diamond Turning Machine using Intelligent Controller, Sponsored by: Industrial Affiliates of the LMA
Serdar Aksu, The Role of Complexing Agents in the Chemical Mechanical Polishing (CMP) of Copper Thin Films, Sponsored by: SDU
