LMAS Research Reports - 2000
Research Report Index
CODEF RESEARCH REPORTS
E. Chibesakunda, Parametric Cost Model for Deburring Processes, Sponsored by: CODEF
Coupling Cost Model (CCM), Sponsored by: CODEF
S.Kumar, Basic Model for Burr Prediction System, Sponsored by: CODEF
K.Lee, Case Study: Burr Formation in Turning of Brass Workpiece with Pockets, Sponsored by: CODEF, MRC Bearings
K.Lee, S.Min, W.M.Fong, DBES: An Internet-Based Drilling Burr Expert System, Sponsored by: CODEF
K.Lee, B.Stirn, I.Essel, Burr Formation in Micro-Machining, Sponsored by: CODEF
K.Leis, Burr Formation in Drilling Intersecting Holes, Sponsored by: Daimler Chrysler
E.Meum, Development of Burr Measurement System, Sponsored by: CODEF
S.Min, Three-Dimensional Finite Element Modeling of Drilling Burr Formation Part 1: Modelling, Sponsored by: CODEF
Three-Dimensional Finite Element Modeling of Drilling Burr Formation Part 2: Modelling, Sponsored by: CODEF
A.Rangarajan, Tool Path Planning Based on Feature Priorities, Sponsored by: CODEF
Tool Entrance/Exit Condition, Sponsored by: CODEF
B.Shyu, Finite Element Simulation for Burr Formation Study, Sponsored by: CODEF
B.Stirn, Study of Burr Formation in Micro-drilling, Sponsored by: CODEF
H.Storhaug, Linking Edge Quality to Part Functionality, Sponsored by: CODEF
PRECISION MANUFACTURING RESEARCH REPORTS
Professor David Dornfeld, Mechanical Aspects of CMP University of California, Berkeley
A. Chang, The Effect of Slurry Film Thickness Variation in Chemical Mechanical Polishing(CMP) of Patterned Oxide Wafers, Sponsored by: NSF/UC SMART
Simulation Software Tools for CMP Modeling, Sponsored by: LMA Industrial Affliates/ UC URO Program
E. Hwang, Fixed Abrasive Design, Sponsored by: UC SMART
Investigation of Material Removal Mechanisms in Oxide CMP by Scratch Test, Sponsored by: UC SMART
P.Joergensen, H.Passman, Energy Consumption Model for Semiconductor Manufacturing Equipment, Sponsored by: Applied Materials
N.Krishnan, The Environmental Value Systems (EnV-S) Analysis, Sponsored by: Applied Materials, NSF/SRC
J.Luo, Integrated Model for the Chemical-Mechanical Polishing Based on a Comprehensive Material Removal Model, Sponsored by: NSF/UC SMART
Material Removal Saturation in Chemical Mechanical Polishing with Abrasive Weight Concentration: Effects of Abrasive Size and Wafer-Pad Contact Area, Sponsored by: NSF/UC SMART
The Effects of Abrasive Size Distribution in Chemical-Mechanical Polishing: Modeling and Verification, Sponsored by: NSF/UC SMART
Improvement of NU in CMP from the Viewpoint of Consumable Effects Based on a Developed Material Removal Model, Sponsored by: NSF/UC SMART
Z. Mao, On the Abrasive Particle Settling Mechanisms in Chemical Mechanical Polishing (CMP), Sponsored by: Industrial Affiliates of the LMA
G. Mastrolilli, Study of Grain Boundary and Orientation Effect in Precision Machining Using Acoustic Emission and Force Sensors, Sponsored by: Industrial Affiliates of the LMA
