LMAS Research Reports - 2001
Download all Research Reports from 2001 (pdf)
Research Report Index
CODEF RESEARCH REPORTS
Amit Bansal, Comprehensive approach to Burr Prediction, Sponsored by: CODEF
Amit Bansal and Kiha Lee, Study of Burr Size and Surface Roughness in High Speed Face Milling, Sponsored by: CODEF
Tool Path Planning in conjunction with Exit Order Sequence, Sponsored by: CODEF, MRC Bearings
Jihong Choi, Influence of Work Hardening Effect on the Exit Burr Formation in 2 Consecutive Ortogonal Cuttings, Sponsored by: CODEF
Kiha Lee, Optimization and Quality Control in Burr Formation using Design of Experiment (I): Face-Milling, Sponsored by: CODEF
Optimization and Quality Control in Burr Formation using Design of Experiment (II): Drilling of Intersecting Holes, Sponsored by: Daimler Chrysler
A Study of Surface Roughness in Micro-End-Milling of Aluminum, Sponsored by: CODEF
Prabhu Ramachandran and Amit Bansal, Integrated Tool Path Planning and Burr Prediction System for Face Milling, Sponsored by: CODEF
Arvind Rangarajan, Probabilistic based Precision Process Planning - "P4", Sponsored by: CODEF
Optimization of the Face Milling Process: Tool Path and Tool Design Issues, Part 1. Algorithm and Tool Path Design, Sponsored by: CODEF
Report on Sandvik Case Study, Sponsored by: CODEF
Borlin Shyu A Finite Element Model of Face Milling, Sponsored by: CODEF
PRECISION MANUFACTURING RESEARCH REPORTS
Edward I. Hwang, End-point detection in the CMP process: review of current approaches, Sponsored by: UC SMART and Applied Materials
End-point detection in the CMP process: AE Sensor, Sponsored by: UC SMART and Applied Materials
Nikhil Krishnan and Uday Ayyagari, A Hierarchical Framework for Integration of Fundamental Physical-Chemical Modeling to inform Environmental Decision Making: A Case study using the Environmental Value Systems Analysis, Sponsored by: NSF/SRC and Applied Materials
Sunghoon Lee and Edward Hwang, SMART Pad Fabrication for CMP, Sponsored by: UC SMART
Jianfeng Luo, Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1, Sponsored by: NSF and UC SMART
Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 2, Sponsored by: NSF and UC SMART
Zhoujie Mao, A Macroscopic Model for CMP, Sponsored by: NSF
