LMAS Research Reports - 2002
Download all Research Reports from 2002 (pdf)
Research Report Index
CODEF RESEARCH REPORTS
Miguel C. Avila, The Effect of Kinematical Parameters and Tool Geometry on Burr Height in Face Milling of Al-Si Alloys, Sponsored by: CODEF
Alexander Balduhn, Model of a Burr Expert System, Sponsored by: CODEF
Jihong Choi and Sangkee Min, Modeling of Inter-Layer Gap Formation in Drilling of a Multi-Layered Material, Sponsored by: CODEF
Kiha Lee, Micro-Burr Formation and Minimization through Process Control, Sponsored by: CODEF
Prabhu Ramachandran, Feasible Offset Region Based Tool Path Planning for Face Milling, Sponsored by: CODEF
Arvind Rangarajan, Probabilistic Precision Process Planning- P4, Sponsored by: CODEF
White Paper on Technical Software Integration, Sponsored by: CODEF
Determining Statistically Significant Parameter Regions for Bounded Specification, Sponsored by: CODEF
GREEN RESEARCH REPORTS
Uday Ayyagari , Nikhil Krishnan and Joaquin Rosales, Integrated Life-cycle Assessment for semiconductor manufacturing processes using the Environmental Value Systems Analysis and EIOLCA, Sponsored by: NSF/SRC and Applied Materials
Peter Broomes, HVAC Modeling for Cost of Ownership Assessment in Biotechnology & Drugs Manufacturing, Sponsored by: LMA Nikhil Krishnan and Uday Ayyagari
The Environmental Value Systems Analysis - Research Report for 2002, Sponsored by: NSF/SRC and Applied Materials
PRECISION MANUFACTURING RESEARCH REPORTS
Edward Hwang, MEMS Applications of CMP Sponsored by: UC SMART Design Rules for the Development of a New-Concept Pad, Sponsored by: UC SMART
Christian R. Keppeler, Micromilling for Mold Fabrication, Sponsored by: LMA
Sunghoon Lee, A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype, Sponsored by UC SMART
Jianfeng Luo, Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales, Sponsored by NSF and UC-SMART
Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity, Sponsored by NSF and UC SMART
C.M.O. Valente, Using Graphical Analysis of Acoustic Emission, Sponsored by Industry Affiliates of the LMA
