LMAS, University of California, Berkeley

Recent LMAS Publications

The publications and reports contained in this section document completed and on-going research at the LMAS starting from 1998. Files are also available from the LMAS California Digital Library Repository.

LMAS Research Reports

2002, 2001, 2000, 1999, 1998

Purchase CODEF publicatons

Presentations

Overview of Green Manufacturing - April 2007 (pdf)

Archival Journal Publications

Ávila, M., Dornfeld, D. (2006), "Exit Order Sequence Burr Prediction Algorithm Based on Rectangular Coordinates", Trans. NAMRI , SME, pp. 301-307

Vijayaraghavan, A. and Dornfeld, D., "Automated Drill Modeling for Drilling Process Simulation," Trans. ASME, J. Computing and Information Science in Engineering, 2006.

Dornfeld, D., Min, S., and Takeuchi, Y., "Recent Advances in Mechanical Micromachining" CIRP Annals, 55, 2, 2006, to appear.

Jeong, H., Kim, H., Lee, S. and Dornfeld, D., “Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues,” CIRP Annals, 55, 1, 2006, to appear.

Min, S., Dornfeld, D., Inasaki, I., Ohmori, H., Lee, D., Deichmueller, M., Yasuda, T., and Niwa, K., “Crystal Orientation Dependency on Machinability in Micromachining of Single Crystal Materials, “CIRP Annals, 55, 1, 2006, pp. 103-106.

Avila, M., and Dornfeld, D. A., “Exit Order Sequence Burr Formation Prediction Algorithm Based on Rectangular Coordinates,” Trans. North American Manufacturing Research Institute, 2006, vol. 34, to appear.

Vijayaraghavan, A., Dharan, C. K. H. , and Dornfeld, D. A., “Quantifying Edge Defects in Drilled FRP Composites,” Trans. North American Manufacturing Research Institute, 2006, vol. 34, pp. 221-228.

Wright, P. K., Dornfeld, D. A., Hillaire, R. G., and Ota, N., K., “A Wireless Sensor for Tool Temperature Measurement and its Integration within a Manufacturing System,” Trans. North American Manufacturing Research Institute, 2006, vol. 34, to appear.

Lee, D. E., Hwang, I., Valente, C. M., Oliveira, J. F., Dornfeld, D. A., “Precision manufacturing process monitoring with acoustic emission,” Int. J. Machine Tools & Manufacture, vol. 46, no. 2, 2006, pp. 176-188.

Chu, C. and Dornfeld, D., “Geometric Approaches for Reducing Burr Formation in Planar Milling by Reducing Tool Exits,” SME J. Manufacturing Systems,7, 2, 2006, 182-195.

Avila, M., Gardner, J., Reich-Weiser, C., Vijayaraghavan, A., Tripathi, S. and Dornfeld, D., "Burr Minimization Strategies and Cleanability in the Aerospace and Automotive Industry", SAE Transactions J. of Aerospace, 114 (1), 2005, pp. 1073-1082.

Wang, C., Sherman, P., Chandra, A., and Dornfeld. D., “Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization, CIRP Annals, 54, 1, 2005, pp. 309-312.

Iturrospe, A., Dornfeld, D. A., Atxa, V., Abete, J. M., “Bicepstrum Based Blind Identification of the Acoustic Emission (AE) Signal in Precision Turning, “ J. Mechanical Systems and Signal Processing, “ 19, 2005, pp. 447-466.

Merchant, M. E., Dornfeld, D. A., and Wright, P., K., “Manufacturing — Its Evolution and Future,” Trans. North American Manufacturing Research Institute, 2005, vol. 33, pp. 211-218.

Lee, K., and Dornfeld, D., “Micro-burr formation and minimization through process control,” Precision Engineering, 29, 2005, pp. 246-252.

Wright, P., Dornfeld, D., Sundararajan, V., and Mishra, D., “Tool Path Generation for Finish Machining of Freeform Surfaces in the Cybercut Process Planning Pipeline,” Trans. NAMRC/SME, 32, pp. 159-166, 2004.

Rangarajan, A., and Dornfeld, D., “Efficient Tool Paths and Part Orientation for Face Milling,” CIRP Annals, 53, 1, 2004, pp. 73-76.

Krishnan, N., Raoux, S., and Dornfeld, D., Quantifying the Environmental Footprint of Semiconductor Process Equipment using the Environmental Value Systems (EnV-S) Analysis, IEEE Trans. Semiconductor Manufacturing, 17, 4, pp. 554-561, 2004.

Kumar, S. and Dornfeld, D., “Basic Approach to a Prediction System for Burr Formation in Face Milling,” J. Mfg. Systems, 5, 2, 2003, pp. 127-142.

Rangarajan, A., Dornfeld, D. , and Wright, P., “Probabilistic Precision Process Planning – P4,” Trans. NAMRC/SME, 31, 2003, 539-546.

Chung, S., Im, Y., Kim, H., Jeong, H., and Dornfeld, D., “Evaluation of micro-replication technology using silicone rubber molds and its applications,” Int. J. Machine Tools and Manufacture, 43, pp. 1337-1345, 2003.

Evans, J., Paul, E., Dornfeld, D., Lucca, D., Byrne, G., Tricard, M., Klocke, F., Dambon, O., and Mullany, B., “Material Removal Mechanisms in Lapping and Polishing,” STC “G” Keynote, CIRP Annals, 52, 2, pp. 611-633, 2003.

Byrne, G., Dornfeld, D., and Denkena, B., “Advancing Cutting Technology,” STC “C” Keynote, CIRP Annals, 52, 2, pp. 483-507, 2003.

Kim, K., Cho, C., Jeon, S., Lee, K and Dornfeld, D., “Drilling and Deburring in a Single Process,” Proc. Instn Mech. Enggrs., Part B: J. Eng. Manufacture, 217, pp. 1327-1331, 2003.

Dornfeld, D. A., Oliveira, J. F. G., Lee, D.,. Valente, C. M. O., “Analysis of Tool and Workpiece Interaction in Diamond Turning Using Graphical Analysis of Acoustic Emission,” CIRP Annals, 52, 1, pp. 479-482, 2003.

Min, S. K., and Dornfeld, D. A., and Nakao, Y., “Influence of Exit Surface Angle on Drilling Burr Formation," J. Manufacturing Science and Engineering, vol. 125, no. 4, pp. 637-644, 2003.

Luo, J. F. and Dornfeld, D. A., “Effects of abrasive size distribution in chemical-mechanical planarization (CMP): modeling and verification,” IEEE Trans. Semiconductor Manufacturing, 16, 3, pp. 112-133, 2003.

Luo, J. F. and Dornfeld, D. A., “Material removal regions in Chemical Mechanical Planarization for Submicron Integrated Circuit Fabrication: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-pad Contact Area,” IEEE Trans. Semiconductor Manufacturing, 2003, vol. 16, no. 1, pp. 45-56.

Luo, J. F. and Dornfeld, D. A., “Optimization of chemical-mechanical planarization (CMP) from the viewpoint of consumable effects,” J. Electrochemical Society, 150, pp. G807-G815, 2003.

Wright, P. K., Dornfeld, D. A., Montero, M. G., and Séquin, C. H., “Management and analysis of design constraints for electronic-mechanical product manufacturing, Trans. North American Manufacturing Research Institute, 2002, vol. 30, pp. 703-710.

Lee, K. and Dornfeld, D., “An experimental study on burr formation in micro-milling aluminum and copper,” Trans. North American Manufacturing Research Institute, 2002, vol. 30, pp. 255-262.

Dornfeld, D., Lee, Y., and Chang, A., “Monitoring of Ultra-precision Machining Processes,” Int. J. Advanced Manufacturing Technology, 2003, vol. 21, pp. 571-578.

Nakao Y., and Dornfeld, D., “Diamond Turning using Position and AE Dual Feedback Control System, “ Precision Engineering, vol. 27, no. 2, pp. 117-124, 2003.

Min, S., Dornfeld, D., Kim, J., and Shyu, B., “Finite element modeling of burr formation in metal cutting,” Machining Science and Technology, 5(3), 2001, pp. 307-322.

Gomes de Oliveira, J., and Dornfeld, D. A., “Application of AE Contact Sensing in Reliable Grinding Monitoring,” CIRP Annals, Vol. 50, No. 1, 2001, pp. 217-220.

Luo, J. F. and Dornfeld, D. A., “Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling,” IEEE Trans. Semiconductor Manufacturing, 14, 2, 2001, pp. 112-133.

Rangarajan, A., Chu, C. H., and Dornfeld, D. A., “Avoiding Tool Exit in Planar Milling by Adjusting Width of Cut,” Proc. ASME IMECE, ASME, MED-Vol. 11, 2000, pp. 1017-1025.

Dornfeld, D. A., Wright, P. K., Roundy, S., Rangarajan, A., and Ahn, S. H., “Agent Interaction in CAD/CAM,” Trans. North American Manufacturing Research Institute, 2001, vol. 29, pp. 569-576.

Wright, P. K., Dornfeld, D. A., Wang, F., and Chu, C. H., “Decisionmaking in Multi-criterion Agent-based Process Planning System, Trans. NAMRI, vol. 28, pp. 293-298, 2000.

Kim, J. and Dornfeld, D, “Development of an Analytical Model for Drilling Burr Formation in Ductile Materials,” ASME Trans. J. Engineering Materials and Technology, vol. 124, no. 2, pp. 192-198, 2002.

Kim, J. Min, S. and Dornfeld, D., “Optimization and Control of Drilling Burr Formation of AISI 304L and AISI 4118 Based on Drilling Burr Control Charts,” Int. J. of Machine Tools and Manufacture, 2001, 41, 7, pp. 923-936.

100. Kim, J. and Dornfeld, D., “Cost Minimization of Drilling Operation by a Drilling Burr Control Chart and Bayesian Statistics,” SME J. Manufacturing Systems, 2001, Vol. 20, No. 2, pp. 89-97.

M. Hashimura, K. Ueda, K. Manabe, and D. Dornfeld, “Analysis of Burr Formation in Orthogonal Cutting,” J. Japan Society of Precision Engineering, Vol. 66, 2, 2000, 218-223 (in Japanese).

M. Hashimura, K. Ueda, K. Manabe, and D. Dornfeld, “Effect of In-plane Exit and Radial Rake Angle on Burr Formation in Face Milling,” J. Japan Society of Precision Engineering, Vol. 66, 1, 2000, 85-90 (in Japanese).

Chu, C. H. and Dornfeld, D., “Linking Tool Paths Generated with Different Offset Distances for Edge Quality Enhancement in Planar Milling,” Proc. Instn Mech. Engrs, Part B. J. Engineering Manufacturing, Vol. 218, pp. 721-730, 2004.

Kim, J. and Dornfeld, D., “Development of a Drilling Burr Control Chart for Stainless Steel,” Trans. North American Manufacturing Research Institute, 2000, vol. 28, pp. 317-322.

Guo, Y. B. and Dornfeld, D. A., “Finite Element Modeling of Drilling Burr Formation Process,” Trans. ASME. J. Manufacturing Science and Engineering., vol. 122, November 2000, pp. 612-619.

Lee, S. H. and D. A. Dornfeld, “Precision Laser Deburring and Acoustic Emission Feedback, Trans. ASME. J. Manufacturing Science and Engineering, 123, 2, 2001, pp. 356-364.

Lee, S. H. and D. A. Dornfeld, “Precision Laser Deburring,” Trans. ASME. J. Manufacturing Science and Engineering., 123, 4, 2001, pp. 601-608.

Chang. Y.P, Hashimura, M. and D. A. Dornfeld, “An Investigation of Material Removal Mechanisms in Lapping with Grain Size Transition,” Trans. ASME. J. Manufacturing Science and Engineering. 122, 3, 2000, pp. 413-419.

I. W. Park, S. E. Ahn and D. A. Dornfeld, "Probabilistic Prediction of Burr Patterns of 1045 Carbon Steel in Face Milling," J. Machining Science and Technology, vol. 6, no. 2, pp. 151-170, 2002.

Park, I. W. and D. A. Dornfeld, "A Study of Burr Formation Processes using the Finite Element Method- Part II- The Influence of Exit Angle, Rake Angle and Backup Material on Burr Formation," Trans. ASME, J. Engineering Materials and Technology, 122, 2000, pp. 229-237.

Park, I. W. and D. A. Dornfeld, "A Study of Burr Formation Processes using the Finite Element Method- Part I," Trans. ASME, J. Engineering Materials and Technology, 122, 2000, pp. 221-228.

Y. P. Chang, M. Hashimura, and D. A. Dornfeld, "Analysis of Orthogonal Micro-cutting using Acoustic Emission," Trans. ASME. J. Eng. Industry, Vol. 122, No. 3, 2000, pp. 413-419.

Refereed Conference Proceedings

Litwinski, K., Min, S., Lee, D., Dornfeld, D., and Lee, N., “Scalability of Tool Path Planning to Micro Machining,” Proc. 1^st Int’l Conf on Micromanufacturing – ICOMM, 2006, Univ. of Illinois, Champaign-Urbana, September 13-15, pp. 174-179.

Avila, M., Reich-Weiser, C. , Dornfeld,D., and McMains, S., “Design and Manufacturing for Cleanability in High Performance Cutting,” Proc. 2^nd Int’l High Performance Cutting Conference, CIRP, Univ. British Columbia, BC, June 2006 (CD ROM only).

Choi, J., Wang, Z., Shen, W., Dornfeld, D. and Hsu, W. "Conditioning Effect on Pad Surface Height Distribution in CMP," Proc. 2nd Int¹l Conf. On Planarization , CMP, and its Application,² Korea CMPUG, Seoul Korea, November, 2005, pp. 403-410

Lee, D., Choi, J., Dornfeld, D. and Kim, H., "Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP," Proc. 2nd Int¹l Conf. On Planarization , CMP, and its Application,² Korea CMPUG, Seoul Korea, November, 2005, pp. 153-157 .

Lee, S. and Dornfeld, D., “Study on the Effects of Pad Design in CMP,” Proc. 2^nd Int’l Conf. On Planarization , CMP, and its Application,” Korea CMPUG, Seoul Korea, November, 2005, pp. 301-307.

Vijayaraghavan, A. and Dornfeld, D., “Challenges in modeling machining in multi-layer materials,” Proc. 8th CIRP Workshop on Modeling of Machining, Chemnitz University, Chemnitz, Germany, May 9-11, 2005.

Baldhun, A., Rangarajan, A., and Dornfeld, D., “Modeling Burr Data for Expert Software Development,” Proc. IMECE, ASME, Nov. 15-21, 2003, Washington, DC, pp. 1-6.

Lee, D. E., Deichmueller, M., Min, S., and Dornfeld, D. A., “Variation in Machinability of Single Crystal Materials in Micromechanical Machining,” Proc. Nanomanufacturing Symposium - KIMM, 2005, pp. 291-294.

Choi, J. and Dornfeld, D., “Chip Scale Topography Evolution Model for CMP Process Optimization,” Proc. 2005 IEEE Int’l Symp. on Semiconductor Manufacturing, IEEE, Sept 13-15, 2005, San Jose CA, pp. 430-433.

Lee, S., Kim, H., and Dornfeld, D., “Development of a CMP Pad with Controlled Micro Features for Improved Performance,” Proc. 2005 IEEE Int’l Symp. on Semiconductor Manufacturing, IEEE, Sept 13-15, 2005, San Jose CA, pp. 173-176.

Krishnan, N., Boyd S., Rosales, J., Roux, S., and Dornfeld, D., Smati, R. , “Using a Hybrid Approach to Evaluate Semiconductor Life Cycle Environmental Issues: A Case Study in Interconnect Module Impacts,” 2004 IEEE International Symposium on Electronics and the Environment,IEEE, Piscataway, NJ. , 2004, pp. 86-90.

Kim, H., Kim, H., Jeong, H., Lee, S., and Dornfeld, D., “Kinematic analysis of chemical mechanical polishing and its effect polishing results,” Key Engineering Materials, vol. 238-239, 2003, pp. 229-234.

Krishnan N, Smati R, Raoux S, Dornfeld D. “Alternatives to reduce perfluorinated compound (PFC) emissions from semiconductor dielectric etch processes: meeting environmental commitments while minimizing costs,” IEEE Int’l Symposium on Electronics and the Environment, 2003, pp.19-24.

Choi, J., S. Min, D. A. Dornfeld, A. Mahboob, T. Tzong, “Modeling of Inter-Layer Gap Formation in Drilling of a Multi-Layered Material, “Proc. 6th CIRP Workshop on Modeling of Machining, McMaster University, Hamilton, ONT, May 19-20, 2003.

Min, S. Dornfeld, D., Kim, J., and Shyu, B., “Finite element modeling of burr formation in metal cutting,” Proc. 4^th CIRP Int’l Workshop on Modeling of Machining Operations, Delft, August, 2001, pp. 97-104.

Min, S., Kim, J. and Dornfeld, D. A., “Thrust Force Analysis of Drilling Burr Formation using Finite Element Method,” 10^th ICOPE Int’l Conference on Precision Engineering,” Japan 2001, pp. 169-173.

Min, S., Kim, J. and Dornfeld, D. A., “Development of Drilling Burr Control Chart for Low Alloy Steel, AISI 4118,” Proc. 5^th Asia Pacific Conference on Materials Processing, 2001, pp 4-9 and J. Materials Processing Technology, 113, 2001, 4-9.

Lee, K. H., Ahn, S. H., Dornfeld, D. A. and P. K. Wright, “The Effect of Run-out on Design for Manufacturing in Micro-machining Process,” Proc. ASME IMECE 2001, MED-Vol.12, ASME, New York, pp.11-17.

Lee, K. H., Stirn, B., and D. A. Dornfeld, “Burr Formation in Micro-machining Aluminum 6061-T6,” 10^th ICOPE Int’l Conference on Precision Engineering,” Japan 2001, pp. 323-338.

Y. Lee and D. A. Dornfeld, Macro-planning of Ductile Regime Machining using Probabilistic Modeling, Proc. 2000 Japan-USA Flexible Automation Conference, Ann Arbor MI, July, 2000, paper 2000JUSFA-13174.

Y. Lee, A. Chang and D.A. Dornfeld, “Acoustic Emission Monitoring for Diamond Machining of OFHC Copper,” International Conference on Precision Engineering (ICOPE), Singapore, March 2000,pp. 323-332.

Y. Moon, A. Chang and D. A. Dornfeld, “The Effect of Slurry Film Thickness Variation in Chemical Mechanical Polishing (CMP),” Proc. 102^nd Annual Meeting and Exposition, American Ceramic Society, St. Louis MO, April 30-May 3, 2000.

Non-Refereed Proceedings-Invited and Conference Papers

Tripathi, S., Doyle, F. and Dornfeld, D., "Tribo-Chemical Modeling of Copper CMP", Proceedings of VLSI Multilevel Interconnection Conference (VMIC), Fremont CA, October 2006, pp. 432-437

Li, X., Wong, C., Dornfeld, D., and Thomas, B., “Research on Subwavelength Microphotonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments,” Proc. 2006 NSF Design, Service and Manufacturing Grantees and Research Conf., St. Louis, MO, July, 2006 (CD).

Dornfeld, D. and Ffield, P., “GOALI: Development of a Comprehensive Drilling Simulation Tool,” Proc. 2006 NSF Design, Service and Manufacturing Grantees and Research Conf., St. Louis, MO, July, 2006 (CD).

Zhang, T., Boyd, S., Vijayaraghavan, A., and Dornfeld, D., "Energy Use in Nanoscale Manufacturing," Proc. 2006 IEEE International Symposium on Electronics and Environment (ISEE), IEEE, May, 2006, San Francisco, to appear.

Boyd, S. Dornfeld, D., and Krishnan, N., “Life Cycle Inventory of a CMOS Chip,” Proc. 2006 IEEE Int’l Symposium on Electronics and the Environment (ISEE), IEEE, May, 2006, San Francisco, to appear.

Choi, J., Tripathi, S., and Dornfeld, D., “Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP”, 2006 CMP-MIC, Fremont CA, February, 2006.

Tripathi, S., Rangarajan, A., and Dornfeld, D., “Tool Path Planning for Reconfigurable Machines,” Pro. 3^rd Int’l Conf. On Reconfigurable Manufacturing, CIRP, Ann Arbor, MI, May, 2005 (CD).

Avila, M., Gardner, J., Reich-Weiser, C., Tripathi, S., Vijayaaraghavan, A., and Dornfeld, D., “Strategies for Burr Formation and Clean Design in Aerospace Manufacturing, “ Proc. 2005 SAE Aerotech Conference, Oct. 3-6, 2005, Dallas Texas, paper 05AMT-17.

Lee , S., Kim, H., and Dornfeld, D., " Performance of a Novel Controlled-contact Area Pad for CMP", Proc. 207^th Meeting of The Electrochemical Society, Quebec, Canada, May, 2005 (abstract only).

Choi, J., Lee , D., and Dornfeld, D., "Acoustic Emission Characteristics of Oxidation and Dissolution in Copper CMP", Proc. 207^th Meeting of The Electrochemical Society, Quebec, Canada, May, 2005 (abstract only).

Choi, J., Lee, D., Kim, H. and Dornfeld, D., “In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP,” Proc. CMP-MIC Conference, February, 2005, pp. 415-422.

Kim, H., Jeong, H., Jeong, Y., Lee, S., Choi, J., Lee, D. and Dornfeld, D., “Effect of Slurry Temperature and Flowrates on Material Removal in Chemical Mechanical Polishing Process,” Proc. CMP-MIC Conference, February, 2005, pp. 225-228.

Lee, S., Kim, H. and Dornfeld, D., “Design Rules for CMP Pad Based on Pad-Characterization and its Prototype Fabrication using Micro Molding,” Proc. CMP-MIC Conference, February, 2005, pp. 25-32.

Choi, J., and Dornfeld, D., “Modeling of Pattern Density Dependent Pressure Non-Uniformity at a Die Scale for ILD CMP, “ Proc. 2004 Materials Research Society Meeting, Vol.816, MRS, San Francisco, April, 2004 (abstract only).

Dornfeld, D., “Micromachining and Burr Formation for Precision Components,” Proc. MTTRF 2005 Meeting, San Francisco, July, 2005, pp. 66-80.

Avila, M., Dornfeld, D., "On the Burr Formation Mechanisms and Minimization Strategies at High Tool Engagement", Intl. Conf. on Deburring and Edge Finishing, UC Berkeley, 2004, pp. 191-200.

Dornfeld, D., “Strategies for Preventing and Minimizing Burr Formation,” Proc. Int’l Conf. On High Performance Cutting, IPT, Aachen Germany, 2004, pp. 83-99.

Jeong, H., Kim, H., Lee, S., and Dornfeld, D., “Technological Approaches in Nanopolishing for Microstructures,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 487-494.

Shefelbine, W. and Dornfeld, D., “The Effect of Dry Cutting on Burr Size,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 469-474.

Avila, M., Choi, J. , Dornfeld, D., Kapgan, M. and Kosarchuk, R., “Deburring of Cross Drilled Hole Intersections by Mechanized Cutting,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 379-389.

Min, S., Lee, D., de Grave, A., Oliveira Valente, C., Lin, J., and Dornfeld, D., “Surface and Edge Quality Variation in Precision Machining of Single Crystal and Polycrystalline Materials, Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 341-350. (A revised version also published as Proc. IMechE, Part B: J. Engineering Manufacture, Vol. 220, 2006, to appear.)

Rangarajan, A. and Dornfeld, D., “Back Cutting and Tool Wear Influence on Burrs in Face Milling – Analysis and Solutions,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 333-340.

Lee, K. and Dornfeld, D., “A Study of Surface Roughness in the Micro-End Milling Process,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 289-296.

Tripathi, S. and Dornfeld, D., “Review of Geometric Solutions for Milling Burr Prediction and Minimization,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 210-208.

Choi, J., Min, S., and Dornfeld, D., “Finite Element Modeling of Burr Formation in Drilling of A Multilayered Material,” Proc. 7^th Int’l Conf. On Deburring and Surface Finishing, Berkeley, CA, 2004, pp. 103-108.

Lee, D., Hwang, I., Dornfeld, D.,” Precision Manufacturing Process Monitoring with Acoustic Emission,” Proceedings AC’04, Zakopane, Poland, 2004.

Merchant, M. E. and Dornfeld, D. A., “Manufacturing — Its Evolution and Future,” Proceedings AC’04, Zakopane, Poland, 2004.

Dornfeld, D., “Future Directions in Manufacturing Research,” NSF Workshop, Madison, WI, June 2, 2003.

Kim, H., Park, B., Jeong, H., Dornfeld, D., and Lee, S., “Application of Fixed Abrasive Pad using Hydrophilic Polymer in STI CMP,” Proc. 2002 ASPE Annual Meeting, St. Louis, MO, 2002, pp. 661-666.

Valente, C., Echizenya, D., Dornfeld, D., and Oliveira, J., “Observing Tool and Workpiece Interaction in Diamond Turning using Graphical Analysis of Acoustic Emission and Force,” Proc. 2002 ASPE Annual Meeting, St. Louis, MO, 2002, pp. 607-612.

Dornfeld, D., “Mechanical Aspects of CMP,” Proc. 17^th VLSI Multilevel Interconnection Conference, June, 2000, pp. 105-111.

Lee, K., Bansal, A., and Dornfeld, D., “Internet-based Milling Burr Expert System,” Proc. 35^th CIRP Int’l Seminar on Mfg. Systems, Seoul Korea, 2002, 470-475.

Min, S., Dornfeld, D., “Application of Four Levels of Drilling Burr Minimization Strategies,” Proc. 2^nd Asia-Pacific Forum on Precision Surface Finishing and Deburring Technology, Seoul Korea, July, 2002, pp. 95-104.

Luo, J. F., and Dornfeld, D., “Optimization of Chemical-Mechanical Planarization (CMP) from the Viewpoint of Consumable Effects,” 2001 Proceedings of 18^th Int’l VMIC Conference, VMIC, September, 2001, pp. 281-289.

Luo, J. F., Dornfeld, D. A., Mao, Z., and Hwang, E., “Integrated Model for Chemical-Mechanical Polishing Based on a Comprehensive Material Removal Model,” 6^th Int’l Conf. On CMP for ULSI Multilevel Interconnection (CMP-MIC), March, 2001, Santa Clara CA, pp. 25-32.

N. Krishnan, D. Bauer, T. Francis, D. Dornfeld, “From Decision Analysis to System Selection for Copper CMP Wastewater Treatment Systems: Using the Environmental Value Systems (ENV-S) Analysis, SEMICON – Japan, Tokyo, October 2000.

C. H. Chu, D. Dornfeld, and C. Brennum, “Prediction and Simulation of Milling Burr Formation for Edge-Precision Process Planning,” Proc. 3^rd Int’l Conf. On Integrated Design and Manufacturing in Mechanical Engineering, Montreal Canada, May 16-19, 2000, Paper No. JA27.4 (CD).

Y. Moon, K. Bevans, and D. A. Dornfeld, “The Mechanical and Chemical Contributions to Material Removal in Chemical Mechanical Polishing (CMP),” 2000 NSF Design and Manufacturing Research Conference, January 3-6, 2000, Vancouver, British Columbia, Canada.

Reports/Edited Volumes/Chapters in Books

Lee, D. E., Hwang, I., Valente, C.M.O. and Dornfeld, D. A., “Precision Manufacturing Process Monitoring with Acoustic Emission” in Condition-based Monitoring and Control for Intelligent Manufacturing, L. Wang and R. Gao, eds., Springer-Verlag, 2006, p. 33-54.

Luo, J. and Dornfeld, D. A., Integrated Modeling of Chemical Mechanical Planarization for sub-micron IC Fabrication: from Particle Scale to Feature, Die and Wafer Scales, Springer-Verlag, Berlin Germany, 2004.

Min, S. K., Dornfeld, D. A. and Reich-Weiser, C., eds., “Proceedings of the 7th International Conference on Deburring and Surface Finishing, “ Berkeley, June 2004.

Min, S. K. and Dornfeld, D. A., “Technology Assessment on Current Advanced Research Projects in Burr Formation, Deburring, and Related Finishing Areas,” AMT – The Association for Manufacturing Technology, January 2004.

Dornfeld, D. A., “Principles of sensors for manufacturing,” in Sensors in Manufacturing, Tönshoff, H. K. and Inasaki, I, eds., Wiley-VCH, Weinheim Germany, 2001.

Dornfeld, D. A., “Publications of CODEF,” 2^nd edition, LMA Report, March 2001.

Dornfeld, D. A., “Publications of CODEF,” LMA Report, March 2000.